Dr. Bukofsky joined the CHIPS R&D Office in January 2024 as the Director of Capabilities for the CHIPS NSTC program. In this role, he is responsible for defining and executing on R&D capabilities to support the National Semiconductor Technology Center, including prototyping facilities and other infrastructure needed to execute a world-class semiconductor R&D program for the benefit of U.S. economic and national security. Prior to CHIPS, Scott spent more than 30 years in the semiconductor industry at IBM Microelectronics, GlobalFoundries, and Synopsys in roles spanning research, technology R&D, and new business development. Scott holds a bachelor’s degree in Microelectronic Engineering from the Rochester Institute of Technology and a Ph.D. in Electrical Engineering from Yale University.