Susan Trulli is a Principal Engineering Fellow in the Advanced Microelectronics Solutions department of Raytheon Missiles and Defense Systems. She is a recognized leader in microelectronics in high reliability microwave packaging, with over 40 years of experience in communication and radar products for defense, space and commercial applications.  Susan is very active in the International Microelectronics Assembly and Packaging Society (IMAPS) serving seventeen years on the Executive Council in multiple positions including the presidency and chairing numerous IMAPS advanced technology workshops in RF and Microwave Packaging.   Susan is an IMAPS Fellow and the recipient of multiple awards including Raytheon’s highest technical achievement award, the Thomas K. Phillips Award for Excellence in Technology, the IMAPS Sidney J. Stein International Award and the Society for Women Engineers Patent Recognition Award.  Susan is focused on gallium nitride (GaN) packaging solutions for high reliability, high power microwave systems and is currently principal investigator for Embedded Die for High Power Microwave Applications through NextFlex.  Susan holds patents in the areas of microwave module design and materials as well as in the areas of printed electronics, thermal design and plasma applicator materials and construction.