Ben Esposito
Principal Engineer
State of The Art (SOTA) Heterogeneous Integrated Packaging (SHIP) Awareness Day
Ben is a Principal Engineer for the PSG Military Aerospace and Government (MAG) Business Unit (BU) and PSG Chief Architect on SHIP responsible for developing heterogenous integrated multi-chip package solutions for Radar and Electronic Warfare (REW) applications. Prior to joining the MAG BU, he worked in the field sales organization including 5 years as an REW Platform Specialist.
Ben started out his career at Intel PSG (Altera) as a Product FAE in 1996 and shortly thereafter become the first DSP Technology Specialist. As a DSP Specialist he was responsible for supporting DSP workloads across the military, wireless, medical, industrial, test and measurement, and automotive market segments. For 25+ years he has been a key contributor in developing the DSP strategy at PSG including DSP silicon features, tools, and IP product definition by working closely with Product Planning, Marketing, Sales and Engineering. He holds an BSEE and MSEE from New Jersey Institute of Technology and has been awarded 17 patents.